Let us test the thermal capacity of the ORS.

The components that heat the most on an operating ORS are usually around the power amplifiers.

In a normal environment, without any heating, the ORS heats up to around 45 - 50 degrees on these parts. 

A scenario in which the ORS is subject to abnormal heat is simulated, with an oven heating up the device. The temperature of the different positions on the ORS, inside the oven, is captured during the whole process.

The oven is heated to 55 degrees for 5 hours, while the ORS LTE is fully operating, in band 39 (1.9 GHz) and with a Tx gain of 70.

The following plot depicts the evolution of the components' temperatures throughout the heating process. 

In this scenario, the power amplifiers heat up to around 80 degrees. Some components, such as radio, also heat  up to around 70 degrees. 

In this way the ORS is proven capable of operating under an ambient temperature of around 55 degrees, a situation in which the FPGA heats up to 85 degrees. 

In theory it should handle FPGA temperatures up to around 95 degrees.